BSME. Executive level microelectronics sales director, managing large direct sales groups, representatives, and field applications engineering staff for analog semiconductor ICs, embedded products and MOSFETs for audio/video, industrial OEM, IT/consumer, medical, military and aerospace applications. Specializes in increased revenue with high volume customers, opening new markets and successfully expanding sales channels. Has sold extensively to Asian markets. Call us for more details! 06122015.6
BSEE. Either regional, national or global sales talent, working with power management ICs, RFIC, analog semiconductor components, custom ASICs, and MOSFETs for power supplies and IT products. Is key account direct contact, builds/trains sales channels, and implants FAE relationships. Creates and maintains long term contracts and conducts high level negotiations with existing and new customers. 110K. 06122015.4
MS-Physics. Board level hardware design specialist, with advanced domestic/international customer support skills, EMI/EMC/ESD compliance, tech docs generation, and component engineering. Performs layout, schematic capture, SoC validation. Involves variety of industries/applications such as medical, motors, power electronics, wireless communications, telephony, SerDes, sensors. Uses Cadence, Altium, Viewlogic, Proteus, PSpice, MATLAB, MathCAD, Allegro. Contract or Direct. 115K. 06102015.3
PhD-EE. Develops and designs power management ICs involving LED drivers, variety of converters (AC/DC, high voltage), mixed signal products, DC/DC switching regulators, controllers, and is skilled with various topologies. Experienced with BiCMOS/CMOS, BCD, CAD, ADC. Defines architecture and manages large SoC projects through to production for lighting, LCD and IT markets. Contract or Direct. 150K. 06102015.01
MBA, BSEE. A semiconductor revenue growth and marketing professional, working with RF ICs, MOSFETs, and embedded FPGA for wireless and networking applications. Guides sales, marketing, product management, R&D, applications staff and strategic partners for increased semiconductor market share. Manages and builds diverse teams, performs negotiations, presentations. Brings field applications engineering background with strong customer technical interaction. 135K. 06092015.2
Ph.D-EE. Leads large military/defense warfare RF/microwave programs involving design experimentation. Products: RF/MMIC, GaN/GaAs/SiGe, MEMs, various drivers, sensors, synthesizers, transceivers, and microelectronics for radar systems, infrared applications, cutting edge antennas/duplexers, phased arrays. Principal Architect on many high profile programs. Awards, Patents, Pubs and has Industry Senior-level Memberships. ADS, Cadence, SpectreRF, Sonnet, EMPro/3D. Contact us for more details! 06042015.3
MSEE. Strong power management IC designer working with analog, mixed signal, MOSFET switches, and CMOS/BiCMOS processes for power electronics, telecommunications and LED/backlighting. Applies to switching and linear converters with various topologies, regulators, drivers, LDOs and chargers. Performs feasibility analysis, modeling, simulation. Uses Cadence Virtuoso, H/PSpice, MathCAD, Python. 15 Years. 130K. 06012015.10
Ph.D-EE. Performs doctoral-level research applied to real-world production of components and devices, such as: Capacitors, cables, magnetics, high voltage DC power electronics; plus specializes in cryogenics, dielectrics, nano-composites, micro-plasmas, and vacuum technologies in lab environments. Applies to federal organizations, military, imaging and utilities. Has developed required laboratories from ground-up. U.S. Citizen. Many publications. Active global industry member. SBIR/STTR. 125K. 06012015.7
Ph.D-EE. Strong innovative design and analysis leader working with microwave circuitry; laser/beam technologies; RF filters, oscillators; analog, RFICs and modules; nanotechnology; silicon, GaN devices and MESFETs for semiconductor. Frequently applied to imaging and magnetics. Conducts frequency analysis and research, testing, calculations, modeling, simulation. Uses HFSS, MATLAB, TCAD, Ansoft, ADS, Eagleware, PSPice, Sonnet, ANSYS, MathCAD, Assembly, C. > 15 Years. 160K. 06012015.6
PhDEE. Strong design skills at chip and board level for active/passive RF components, modules, MMIC, millimeter-wave devices and subsystems including amplifiers, phase shifters, filters, transceivers, and ruggedized devices. Proven experience with GaAs PHEMT/ HBT, SiGe HBT, and GaN process. Concept and architecture into modeling, simulation, layout, test, tuning, and troubleshooting, including military applications. Uses ADS, HFSS, AutoCAD. Patents. 120K. 05192015.6
BS-Physics. High level processing engineering professional, leading process engineers for telecommunications optical device component manufacturing. Performs equipment start-up, yield improvement (>99%), root cause/failure analysis, employs complex mathematical methods & statistical data, and manages departments, projects. Involves wafer fab, thin film metrology, metallization (IAD, IBS, sputtering, MEMS, etch), AR/HR coatings (lasers, silica, Si, GaP, InP, SLEDS), dichroic mirror stress/evaporation concerns, and SiO2 masking. Strong customer interaction. Multilingual. 170K. 05182015.3
BSIE. Brings technical background to sales revenue growth involving semiconductors and power supplies systems/components, switches, connectors, converters and adapters related to telecommunications and wireless applications. Participates heavily in product development, strong relationship builder, and skilled negotiator for enhanced profit margins. Involved from quote stage through production, and often leads customers during factory audits in Europe and Asia. 90K. 05152015.2
Specializes in OEM client relationship management and multi-million $ PCB and other components sales with large organizations, developing complex strategy, performing marketing, negotiations, onsite customer service and end user training. Extensive territory, representative network, VAR/reseller development. Translates customer requirements into solutions specifications. Has P&L accountability. Applies to telecommunications and networking markets. 75K. 05142015.3
MSEE. Power management/mixed signal RFIC manual and automated tester for wireless & mobile telecommunications. Involves customer-specific test solutions, characterization, root cause analysis, debug on various frequency bands, calibration, scattered parameter/NF measurements, harmonics, load-pull, GPIB/serial/ethernet instrument control, circuit tuning and DVT. Scrum/Agile and lab environments. Supervises production technicians. Uses FPGA, MATLAB, LabVIEW, TestStand, DxDesigner, PSpice, Orcad, ExpressPCB, AWR Microwave Office. 10 Years. 05142015.2
Specializes in overseeing PCB design and layout for 3000 watt power supplies with power conversion, brick topology and component engineering experience, applying to telecommunications. Also works with overseas staff, provides electro-mechanical packaging skill, strong new product customer interface and regulatory/safety concerns. Maintains component library, supports component sourcing, and has participated in smooth technical documentation merger transition. 120K. 05082015.3
Strong background in PCB layout and design with excellent designing software expertise. Skilled in IC and RFIC design for gyros and timing devices, oscillators, transceivers, modems and touchscreens (IT products). Also designs electronics for LCDs. Uses Cadence Virtuoso, Springsoft Laker, Valid LED, Tanner, ECAD, Magma, Avanti, Cadabra, Simplex, Rapheal, and also GPL, TCL, CMOS, Unix. Contract or Direct hire. Flexible salary range. 05062015.4
Ph.D-EE. Scientist-level R&D design, development, analysis and debug:
- RF/microwave circuitry, semiconductor/components, compound devices, planar antenna arrays, communication systems, dual/Ka/X-band SATCOM, and imaging systems for aerospace, defense and commercial.
- Project examples: Next-generation ultra-fast PLL frequency synthesizers, and multi-stage radar receiver protectors/limiter modules.
- Performs high-frequency electromagnetic analysis, packaging, 3D modeling, simulation and hands-on fabrication.
Serves industry as theoretical expert and also Program Management, Technology Transfer Head. Uses HFSS, ADS, Microwave Office, MATLAB, AutoCAD, Ansys & much more. >10 Years. 140K. 04272015.2
MBA, MSEE. Brings highly technical hand to sales management and large key account development for automotive & HEV semiconductor and components: Power management ICs, SoC, mixed signal, MOSFET, ASIC, MEMS, microcontrollers. Applies specifically to smartpower, battery management, analog decoders, wireless functions, powertrain and navigation. Supervises mfg reps, develops strategies, manages demand creation and IC development and leads customer/design team communications. Initiates new product introductions and directs design-ins. 140K. 04202015.2
MSEE. Consistent technical and business development talent in display/analog IC engineering, IT device circuitry and memory semiconductor ICs. Provides global sales and marketing leadership with customer design-in activities and technical support (world-wide field applications), failure analysis, and defining future product lines. Heavily involved in concept and product architecture design. Many patents. Expert on cell structure. >15 Years. Contact us for more details! 04152015.4
MBA, BS-Microelectronics. Responsible for high profile/key global accounts and channel sales for power management ICs applicable to automotive subsystems. Expert in building successful sales staff and field applications engineering groups for extreme revenue growth levels. Drives representative firms to capture new business. Negotiates annual pricing agreements and develops realized business plans. Manages custom design programs through fruition. Thrives in startup and revenue critical turn-around environments. 130K. 04142015.7
MBA, BSEE/Honors. Routinely captures additional 7 figures revenue for high/mid power LED lighting semiconductor organizations.
- Global comfort and looks extensively to Asia for resourcing and product design/manufacturing team building, alliances
- Specifies/creates next-generation LED products
- Marketing powerhouse with branding, scientific-level marketing analysis and execution for business capture across all industries, from retail to military
Consultative sales, often displaces competition. Contact us for more details! 04142015.5
Leads semiconductor product innovation/management to include applications and R&D engineering groups. Hatches 100’s of new generation power management ICs, SiC JFET/MOSFETs, diodes, and multi-chip packages for variety of industries and reverse innovates to integrate to end product NPI. Drives projects schedule, budget and forward-years roadmaps, resulting in significant revenue. Works with IGBTs, LED drivers, gate drivers and high voltage applications – especially for automotive. BS-Microelectronics/plus. Patents. 170K. 03242015.2
MSEE/CE. Industry renown test engineering teacher, guru and hands-on test platform and software developer for sustaining and next-generation power management ICs and PCBs.
- Manages/trains large test teams, sets guidelines, improves methodologies, develops characterization/specialized programs (NPI) and ATE for production release.
- Results oriented. Improves yield, testing time, speeds processes for production schedules.
- Multiple sites. Collaborates with overseas subs and product transfer coordination.
End product lines: Power electronics, RF/wireless, consumer electronics, imaging, sensors, connectivity. 190K. 03242015.01
MSEE. Recent graduate with consummate yield and failure analysis skills for product performance management. Works with multi-layer PCB, analog and semiconductor devices prior to packaging – applying to amplifiers, voltage regulators, transmitters, converters. Performs in-depth root cause and test/troubleshooting activities at board and component level. Repairs, programs, updates and maintains test equipment. Is go-to for line technicians. Uses all manner of test tooling and Cadence, MultiSim, AutoCAD, Circuitmaker, MATLAB, LabView. 10 Years. 03132015.3
BSEE. Performs thorough bench characterization for SerDes transceivers, DDR2/3 to RVB level, and DDR1&2 for memory module/DIMM industry.
- Char plan development, socket/thermal plunger design
- Component and system level debug
- Test results/data analysis and reporting
- Station setup and automation plus ATE program enhancement
- Customer returns (RMA) test verification and troubleshooting
Uses skills to support product performance improvements, and participates in new production release/marketing documentation. Fully skilled on relevant test tooling. Python. 03052015.6
MSEE/CE. Lead design, layout, development and test of high voltage power supplies for plasma generators, MRI/imaging systems, DC/DC converters, flyback converters and 4 layer high current power supplies. Performs extensive redesign effort, provides verification, thermal and component margining, certification tests and development of test specifications. Uses MATLAB, Simulink, SimElectronics, MathCAD, LTSpice, PADS, Cadence, Agilent and more. Previous secret clearance. 15 Years. 110K. 03032015.6
MSCE. Substantial failure analysis work with embedded firmware for serial communications, from hard drives to failure analysis at component level, for in-house builds and customer returns (RMAs). Performs firmware debug and kerneling. Interfaces with suppliers and overseas factories regarding failures. Technologies include: SCSI, ATA, SATA, and logic/bus analyzers – ARM7. Skills: ASICs, C, Vrtex32, VxWorks, Assembly, Linux, ADS, Agile. 110K. 02252015.4
Ph.D.-Chem/>10 Years. Has concentrated experience with highly complex failure analysis for quality and reliability. Performs root cause, metrology and statistical data analysis, equipment qualification, material property studies and development for improved shock and thermal cycling performance, studies methods for soldering joint cracks during thermal cycling, and resolves temperature cycling reliability issues. Design new board electronic package components. Has reduced test board requirements by one third. Has a strong background in developing semiconductor processes involving photolithography, multi-layer, metallography, ultraviolet curable and anti-reflective coatings, polymer/surface characterizations, and substrates/rheology adhesion. Has multiple formal awards and recognition. 110-130K. 02242015.3
MSEE/15 Years. A dual talented professional engineer working with microelectronics/power components and semiconductors such as power modules (for configurable power supplies, converters and regulators), branch circuit monitoring sensors for DC/DC boost converters, polymeric sensors, power management/analog and ASICs. Additional products include RF and power systems such as switchmode power supplies, high speed digital data transmission, transducer bridges. Provides various types of customer technical support, strives to extend customer support through and beyond delivery, and focuses on demand creation. Applies to military, automotive and transportation industries. Multiple publications and has patent activity. 100K. 02242015.2
Ph.D.-Metallurgy/20 Years. A principal technical staff member driving various plasma etch technologies such as: Photomask fabrications, ultraviolet lithography, atomic layer deposition, and TSV (3-dimensional). Works with artificial neural network for process optimization and control, provides LER/LWR characterization and modeling, and has designed full plasma laboratory. Applies to opticals, ICs, materials and energy. An innovator, renown author and patent generator. Has a background with nano-composite materials (MMC) and ionic liquid applications. Thrives in start-up environments to make a bottom-line difference. Contact us for more details! 02172015.7
BS-Chem/> 20 Years. Comprehensive experience to automate and improve plasma etch manufacturing processes (wafer/substrate levels) and semiconductor fabrication (front/back end) for medical packaging/implantables, commercial and IC applications. Designs a wealth of auto/non-automated tooling and fixtures. Has brought facilities to current technology by implementing equipment enhancements for lab demand fulfillment (plasma cleaners, screen printers, reflow machinery), and has sourced/specified custom equipment for automated module processing versus manual (25% higher yield; 50% throughput). Routinely provides technical support for etch processes (polysilicon gate, STI, trench, metals, SWN, cap oxide) with internal/external interface, validates new processes, updates specifications, develops/validates solder reflow profiles/SMT, and implements and maintains controls (SPC). Has implemented special projects, such as start-up wafer fab facilities overseas. 70-80K. 02172015.4
MSEE/>20 Years. Has significant experience defining customer requirements for power management ICs, converters with various topologies, UPS, DC/DC, AC/DC, and GPS / remote sensing for military/defense, semiconductor, and other industries. Focus is on broad system architectural design customers’ end solutions, generating schematics, layouts, and technical documentation, and performs lab simulation and presentations. Provides frequent pre- and post-sales on-site lab assistance, reviews customer-owned technical documentation, and has constructed customer tooling. 100-140K. 02162015.4
MSEE, MS-Physics/>20 Years. Performs new product introductions (NPI) and development for semiconductor analog / digital power management products, SoC and ICs, involving signal processors in mix-mode CMOS, switching amplifiers in BiC-DMOS, optical storage and more. Performs mixed-signal testing (including ADC/DAC), multi-temp and voltage characterization, product and burn-in boards qualification, validation (latch-up, ESD, life test failure), SPC and yield enhancements, and complex failure analysis. Works with off-shore manufacturing and customer returns program, and resolves specification problems. Has strong focus on product reliability and process improvements / optimization. Industries are audio/visual, RF wireless telephony and networking/IT (processors, ethernet, consumer electronics). Uses Eagle, IDS E-beam, Credence, Agilent and more. 100K. 02042015.1
BSEE/15 Years. Has product engineering focus in 150mm to 300mm process factories for advanced 0.13 to 0.25 micron high power, high density analog CMOS and Bi-CMOS for prototype devices. Drives from concept to production, performing qualification / characterization, and generating specifications, and pre-production samples. Significant test engineering lead (test plans, binning, critical ramp through volume, platform conversion). Routinely reduces packaging costs (10%) and has released several mixed signal products to exceed corporate sales revenue goals by 80%. Vast array of tools and languages: Embedded C, PERL, MathLab, SAP, Spotfire and more. Test technologies/platforms: TestWare, ATE, VLCT, IFLEX, Catalyst, A580. 90-100K. 02032015.1
BSEE/CE, 20 Years. Applies substantial technical knowledge to sales management for networking products, including: Hard drives/data storage solutions (SATA, SAS, SCSI, SSD, Fibre Channel), host bus, ethernet devices, routers, high speed interfaces, sensors, adapters and boards, ASICs, digitial-to-analog, DSP, processors, embedded microprocessors and a variety of related software. Also has a background in other various semiconductor ICs, SoC and power conditioning. Relates to large customers and senior level executives. 100K. 02022015.4
MBA, BSEE/>20 Years. An executive level product definition / management leader for analog, power switching, battery chargers, energy harvesting devices, LED drivers, buck/boost regulators, amplifiers, audio systems, plus power management ICs and wafer fabrication; applying to power electronics, mobile telephony / consumer electronics, wireless sensor networks and RF, military/defense and general industrial. Develops product technology roadmaps, manages high 8-figure annual revenue product line, provides “look-ahead” 3-year product line planning strategies, oversees yearly operating plan implementation, achieves design wins, ensures highest return product lines are in pipeline and that revenue commitment goals are met. Substantial customer and supplier interaction, including overseas. Extensive background in wafer fabrication. 200K. 01302015.4
MS-Engrg Mgmt, BSEE, PE/15 Years. Comprehensive experience in quality management with reliability engineering in semiconductor and medical manufacturing laboratory environments. Ensures regulatory compliance to include FDA Waterfall, USDA, ISO 13485. Works with SMT PCB issues, customer problem resolution, new product development Q/C, and is stop-gap for potential market release complications. Approves verification and validation plans. Drives MRB and internal / external corrective action. Manages supply chain from quality perspective including on-site audits, tests. Certified Quality Auditor and Engineer, Six Sigma Black Belt. 120-130K. 01302015.3
MSEE/>20 Years. Has comprehensive expertise in failure analysis, test engineering and product launch for semiconductor power ICs, MOSFET drivers, CMOS-integrated voltage regulator ICs for buck converters, and integrated power distribution / protection ICs in CSP and fcQFN packages and more. Performs bench evaluation, ATE characterization, fault isolation, and product qualification. Designs burn-in circuits, generates schematics and approves PCB layouts. Ensures that products packages comply to: JEDEC/HTOL, ESD, LU, HAST, PRECON, HTS, TC, THB. Uses DataPower, Bench-ATE, OrCAD. 100K. 01302015.1
BSEE w/ME / 15 Years. Identifies major programs/product growth areas and defines product requirements to achieve new business from Tier 1 aerospace and military/defense customers for semiconductor Power ICs/MOSFETs. Manages, motivates and trains manufacturer reps and distributors to gain new accounts, conducts customer presentations, and develops strategic relationships with customer technical staff for better market positioning. 125-135K. 01292015.3
MSEE/20 Years. Provides semiconductor IC manufacturing fabrication and MMIC / SiC / GaAs wafer fabrication facility management. Install new systems such as LPCVD, develops various technologies such as nanowire processes for innovative battery applications, troubleshoots and repairs lab equipment / instruments such as CVD and RTP systems. Develops CVD thin films, gold plating processes, and GaAs wafer wet chemical etch process to improve uniformity for RF power products, and uses SPC for quality control. Has expertise in initial lab setups (startups) and refurbishments with focus on enhanced performance and resulting reduced costs. 70-80K. 01292015.1